Products
Manufacturer
RFQ
Nwes
ContactMicrocontrollers(83924)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | ECCN Code | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Qualification Status | JESD-30 Code | Supplier Device Package | Oscillator Type | Number of I/O | Peripherals | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Clock Frequency | Address Bus Width | External Data Bus Width | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC68L11E1FNE2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | 0°C~70°C TA | Tube | 3 (168 Hours) | HCMOS | 4.57mm | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc11e0cfne2-datasheets-1468.pdf | 52-LCC (J-Lead) | 19.1262mm | 19.1262mm | 52 | EAR99 | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | J BEND | 250 | 5V | 1.27mm | MC68L11 | 5.5V | 3V | 30 | Not Qualified | S-PQCC-J52 | Internal | 38 | POR, WDT | 512 x 8 | 2MHz | MICROCONTROLLER | 8 | YES | NO | NO | NO | 8MHz | 16 | 8 | 3V~5.5V | ROMless | 8-Bit | SCI, SPI | A/D 8x8b | 512 x 8 | |||||||
| MC68376BGCAB25 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68376bgmft20-datasheets-9714.pdf | 160-BQFP | MC68376 | External | 18 | POR, PWM, WDT | 7.5K x 8 | 25MHz | CPU32 | 4.75V~5.25V | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | A/D 16x10b | ||||||||||||||||||||||||||||||||||||
| MC68L11E1CFNE2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | HCMOS | 4.57mm | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc11e0cfne2-datasheets-1468.pdf | 52-LCC (J-Lead) | 19.125mm | 19.125mm | 52 | EAR99 | 8542.31.00.01 | e3 | MATTE TIN | YES | QUAD | J BEND | 250 | 5V | 1.27mm | MC68L11 | 5.5V | 4.5V | 30 | Not Qualified | S-PQCC-J52 | Internal | 38 | POR, WDT | 512 x 8 | 2MHz | MICROCONTROLLER | 8 | YES | NO | NO | NO | 8MHz | 16 | 8 | 3V~5.5V | ROMless | 8-Bit | SCI, SPI | A/D 8x8b | 512 x 8 | |||||||
| MC68332GVEH20 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68332aceh20-datasheets-1920.pdf | 132-BQFP Bumpered | MC68332 | Internal | 15 | POR, PWM, WDT | 2K x 8 | 20MHz | CPU32 | 4.5V~5.5V | ROMless | 32-Bit | EBI/EMI, SCI, SPI, UART/USART | |||||||||||||||||||||||||||||||||||||
| MC711K4CFUE3 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc11k1cfn4-datasheets-9726.pdf | 80-QFP | MC711K4 | 80-QFP (14x14) | Internal | 62 | POR, PWM, WDT | 768 x 8 | 3MHz | HC11 | 4.5V~5.5V | OTP | 8-Bit | 24KB 24K x 8 | SCI, SPI | A/D 8x8b | 640 x 8 | ||||||||||||||||||||||||||||||||||
| MC68HC711D3CFNE3 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | 4.57mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc711d3cfne2r-datasheets-3880.pdf | 44-LCC (J-Lead) | 16.585mm | 16.585mm | 44 | 8542.31.00.01 | YES | QUAD | J BEND | 5V | 1.27mm | MC68HC711 | 5.5V | 4.5V | S-PQCC-J44 | Internal | 26 | POR, WDT | 192 x 8 | 3MHz | MICROCONTROLLER | 8 | NO | NO | NO | NO | 12MHz | 16 | 8 | 4.5V~5.5V | OTP | 8-Bit | 4KB 4K x 8 | SCI, SPI | |||||||||||||||
| MPC565CVR40 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC5xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-mpc565mvr56-datasheets-3095.pdf | 388-BBGA | MPC565 | 388-PBGA (27x27) | External | 56 | POR, PWM, WDT | 36K x 8 | 40MHz | PowerPC | 2.5V~2.7V | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, SCI, SPI, UART/USART | A/D 40x10b | ||||||||||||||||||||||||||||||||||
| MC9S08RG32CFGE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 44-LQFP | unknown | 8542.31.00.01 | MC9S08RG32 | Internal | 39 | LVD, POR, PWM, WDT | 2K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 32KB 32K x 8 | SCI, SPI | |||||||||||||||||||||||||||||||||
| MC9S12B64VPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12b64cfue-datasheets-8362.pdf | 112-LQFP | MC9S12B64 | 112-LQFP (20x20) | Internal | 91 | POR, PWM, WDT | 2K x 8 | 25MHz | HCS12 | 2.35V~5.5V | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, SCI, SPI | A/D 16x10b | 1K x 8 | |||||||||||||||||||||||||||||||||
| MC68908GR16VFJE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~105°C TA | Tray | 1 (Unlimited) | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908gr16cfae-datasheets-4826.pdf | 32-LQFP | MC68908 | 32-LQFP (7x7) | Internal | 21 | LVD, POR, PWM | 1K x 8 | 8MHz | HC08 | 3V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | LINbus, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||
| MC9S12B128VFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12b64cfue-datasheets-8362.pdf | 80-QFP | MC9S12B128 | 80-QFP (14x14) | Internal | 59 | POR, PWM, WDT | 4K x 8 | 25MHz | HCS12 | 2.35V~5.5V | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | A/D 8x10b | 1K x 8 | |||||||||||||||||||||||||||||||||
| MC9S08RG60FGE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 44-LQFP | unknown | 8542.31.00.01 | MC9S08RG60 | Internal | 39 | LVD, POR, PWM, WDT | 2K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 60KB 60K x 8 | SCI, SPI | |||||||||||||||||||||||||||||||||
| MC908GR16AVFJE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908gr16acfae-datasheets-8681.pdf | 32-LQFP | 8542.31.00.01 | MC908GR16 | Internal | 21 | LVD, POR, PWM | 1K x 8 | 8MHz | MICROCONTROLLER | 3V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | LINbus, SCI, SPI | A/D 8x10b | ||||||||||||||||||||||||||||||||||
| MC9S08RD60CFGE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 44-LQFP | 8542.31.00.01 | MC9S08RD60 | Internal | 39 | LVD, POR, PWM, WDT | 2K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 60KB 60K x 8 | SCI | ||||||||||||||||||||||||||||||||||
| MC908AZ60AVFUER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908az60acfue-datasheets-2002.pdf | 64-QFP | MC908AZ60 | Internal | 52 | LVD, POR, PWM | 2K x 8 | 8.4MHz | 4.5V~5.5V | FLASH | 8-Bit | 60KB 60K x 8 | CANbus, SCI, SPI | A/D 15x8b | 1K x 8 | |||||||||||||||||||||||||||||||||||
| MC68HC711E9CFNE2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2001 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc711e20cfn3-datasheets-9646.pdf | 52-LCC (J-Lead) | MC68HC711 | Internal | 38 | POR, WDT | 512 x 8 | 2MHz | 4.5V~5.5V | OTP | 8-Bit | 12KB 12K x 8 | SCI, SPI | A/D 8x8b | 512 x 8 | |||||||||||||||||||||||||||||||||||
| MC9S08RG60FJE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 32-LQFP | unknown | 8542.31.00.01 | MC9S08RG60 | Internal | 27 | LVD, POR, PWM, WDT | 2K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 60KB 60K x 8 | SCI, SPI | |||||||||||||||||||||||||||||||||
| MC9S08RD8CFGE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08rg32fge-datasheets-4464.pdf | 44-LQFP | unknown | 8542.31.00.01 | MC9S08RD8 | Internal | 39 | LVD, POR, PWM, WDT | 1K x 8 | 8MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 8KB 8K x 8 | SCI | |||||||||||||||||||||||||||||||||
| MC68336AMAB20 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68376bgmft20-datasheets-9714.pdf | 160-BQFP | MC68336 | 160-QFP (28x28) | External | 18 | POR, PWM, WDT | 7.5K x 8 | 20MHz | CPU32 | 4.75V~5.25V | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | A/D 16x10b | |||||||||||||||||||||||||||||||||||
| MC68376BAMAB20 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68376bgmft20-datasheets-9714.pdf | 160-BQFP | MC68376 | 160-QFP (28x28) | External | 18 | POR, PWM, WDT | 7.5K x 8 | 20MHz | CPU32 | 4.75V~5.25V | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | A/D 16x10b | |||||||||||||||||||||||||||||||||||
| MC68376BACAB25 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68376bgmft20-datasheets-9714.pdf | 160-BQFP | MC68376 | External | 18 | POR, PWM, WDT | 7.5K x 8 | 25MHz | CPU32 | 4.75V~5.25V | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | A/D 16x10b | ||||||||||||||||||||||||||||||||||||
| MPC564MVR56 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC5xx | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-mpc562czp40-datasheets-9791.pdf | 388-BBGA | MPC564 | External | 56 | POR, PWM, WDT | 32K x 8 | 56MHz | PowerPC | 2.5V~2.7V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, SCI, SPI, UART/USART | A/D 32x10b | |||||||||||||||||||||||||||||||||||
| MCS12KG256VPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12kt256cpve-datasheets-1252.pdf | 112-LQFP | MCS12KG256 | 112-LQFP (20x20) | Internal | 91 | LVD, POR, PWM, WDT | 12K x 8 | 25MHz | HCS12 | 2.35V~5.5V | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, SCI, SPI | A/D 16x10b | 4K x 8 | |||||||||||||||||||||||||||||||||
| MC9S08GT60CFBE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08gt32cfb-datasheets-0048.pdf | 44-QFP | MC9S08GT60 | Internal | 36 | LVD, POR, PWM, WDT | 4K x 8 | 40MHz | 1.8V~3.6V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||
| MC68336ACAB25 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68376bgmft20-datasheets-9714.pdf | 160-BQFP | MC68336 | External | 18 | POR, PWM, WDT | 7.5K x 8 | 25MHz | CPU32 | 4.75V~5.25V | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | A/D 16x10b | ||||||||||||||||||||||||||||||||||||
| MC68HC711D3CFNE2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc711d3cfne2r-datasheets-3880.pdf | 44-LCC (J-Lead) | MC68HC711 | Internal | 26 | POR, WDT | 192 x 8 | 2MHz | 4.5V~5.5V | OTP | 8-Bit | 4KB 4K x 8 | SCI, SPI | |||||||||||||||||||||||||||||||||||||
| MCHC908JK8MPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Through Hole | -40°C~125°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908jl8cfaer2-datasheets-4848.pdf | 20-DIP (0.300, 7.62mm) | MCHC908JK8 | Internal | 15 | LED, LVD, POR, PWM | 256 x 8 | 8MHz | 4.5V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | SCI | A/D 13x8b | |||||||||||||||||||||||||||||||||||||
| MC68HC11A0CFNE3 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc11a1mfner-datasheets-4086.pdf | 52-LCC (J-Lead) | MC68HC11 | 52-PLCC (19.1x19.1) | External | 38 | POR, WDT | 256 x 8 | 3MHz | HC11 | 4.5V~5.5V | ROMless | 8-Bit | SCI, SPI | A/D 8x8b | |||||||||||||||||||||||||||||||||||
| MC68376BAVAB20 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | M683xx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68376bgmft20-datasheets-9714.pdf | 160-BQFP | MC68376 | External | 18 | POR, PWM, WDT | 7.5K x 8 | 20MHz | CPU32 | 4.75V~5.25V | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI | A/D 16x10b | ||||||||||||||||||||||||||||||||||||
| MC68HC705C9AVFNE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC05 | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc705c9acp-datasheets-9583.pdf | 44-LCC (J-Lead) | MC68HC705 | Internal | 24 | POR, WDT | 352 x 8 | 2.1MHz | 3V~5.5V | OTP | 8-Bit | 16KB 16K x 8 | SCI, SPI |
