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| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | ECCN Code | Additional Feature | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Qualification Status | JESD-30 Code | Supplier Device Package | Oscillator Type | Number of I/O | Peripherals | RAM Size | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM (words) | Clock Frequency | Address Bus Width | External Data Bus Width | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC9S12XDT256CAG | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12xdp512cal-datasheets-2633.pdf | 144-LQFP | MC9S12XDT256 | External | 119 | LVD, POR, PWM, WDT | 16K x 8 | 80MHz | 2.35V~5.5V | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | A/D 24x10b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||
| MC9S08GT8ACBE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | -40°C~85°C TA | Tube | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08gt16acfbe-datasheets-7697.pdf | 42-SDIP (0.600, 15.24mm) | unknown | 8542.31.00.01 | MC9S08GT8 | Internal | 34 | LVD, POR, PWM, WDT | 1K x 8 | 40MHz | MICROCONTROLLER | 1.8V~3.6V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||
| MPC555LFMZP40R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC5xx | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | Non-RoHS Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mpc555lfmvr40-datasheets-2058.pdf | 272-BBGA | MPC555 | External | 101 | POR, PWM, WDT | 26K x 8 | 40MHz | PowerPC | 2.7V~5.5V | FLASH | 32-Bit | 448KB 448K x 8 | CANbus, EBI/EMI, SCI, SPI, UART/USART | A/D 32x10b | |||||||||||||||||||||||||||||||||||||||||
| MC9S08GT32ACBE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | 2008 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08gb60acfue-datasheets-0383.pdf | 42-SDIP (0.600, 15.24mm) | MC9S08GT32 | Internal | 33 | LVD, POR, PWM, WDT | 2K x 8 | 40MHz | 1.8V~3.6V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||
| MC9S12DJ256VPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12dg256cpve-datasheets-5488.pdf | 112-LQFP | MC9S12DJ256 | Internal | 91 | PWM, WDT | 12K x 8 | 25MHz | 2.35V~5.25V | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, I2C, SCI, SPI | A/D 16x10b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||
| MC9S12KG128CPVE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12kg128vpve-datasheets-1254.pdf | 112-LQFP | MC9S12K128 | Internal | 91 | LVD, POR, PWM, WDT | 8K x 8 | 25MHz | 2.35V~5.5V | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, SCI, SPI | A/D 16x10b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||
| MC11E1CPBE2R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc11e0cfne2-datasheets-1468.pdf | 52-LQFP | MC11E1 | Internal | 38 | POR, WDT | 512 x 8 | 2MHz | 4.5V~5.5V | ROMless | 8-Bit | SCI, SPI | A/D 8x8b | 512 x 8 | ||||||||||||||||||||||||||||||||||||||||||
| XC68HC58EGAR2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 28-SOIC (0.295, 7.50mm Width) | XC68HC58 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC705C9ACPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC05 | Through Hole | -40°C~85°C TA | Tube | Not Applicable | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc705c9acp-datasheets-9583.pdf | 40-DIP (0.600, 15.24mm) | MC705 | Internal | 24 | POR, WDT | 352 x 8 | 2.1MHz | 3V~5.5V | OTP | 8-Bit | 16KB 16K x 8 | SCI, SPI | ||||||||||||||||||||||||||||||||||||||||||
| MC9S08GT60ACBE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | -40°C~85°C TA | Tube | 1 (Unlimited) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08gb60acfue-datasheets-0383.pdf | 42-SDIP (0.600, 15.24mm) | MC9S08GT60 | Internal | 33 | LVD, POR, PWM, WDT | 4K x 8 | 40MHz | 1.8V~3.6V | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||
| MC9S12E128VFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12e64cfue-datasheets-1177.pdf | 80-QFP | EAR99 | 8542.31.00.01 | e3 | MATTE TIN | 260 | MC9S12E128 | 40 | Internal | 60 | POR, PWM, WDT | 8K x 8 | 25MHz | MICROCONTROLLER | 2.35V~2.75V | FLASH | 16-Bit | 128KB 128K x 8 | EBI/EMI, I2C, SCI, SPI | A/D 16x10b; D/A 2x8b | |||||||||||||||||||||||||||||||||
| MC9S12KG128VFUE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12kg128vpve-datasheets-1254.pdf | 80-QFP | MC9S12K128 | Internal | 59 | LVD, POR, PWM, WDT | 8K x 8 | 25MHz | 2.35V~5.5V | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, SCI, SPI | A/D 8x10b | 2K x 8 | ||||||||||||||||||||||||||||||||||||||||
| LPC2138FHN64/01,55 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC2100 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1mm | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc2138fbd640115-datasheets-1312.pdf | 64-VFQFN Exposed Pad | 9mm | 9mm | 64 | 8542.31.00.01 | e3 | TIN | YES | QUAD | NO LEAD | 260 | 3.3V | 0.5mm | LPC2138 | 64 | 3.6V | 3V | 30 | Microcontrollers | 3.3V | Not Qualified | S-PQCC-N64 | Internal | 47 | Brown-out Detect/Reset, POR, PWM, WDT | 32K x 8 | 60MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | YES | 524288 | 60MHz | 8 | 8 | ARM7® | 3V~3.6V | FLASH | 16/32-Bit | 512KB 512K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | A/D 16x10b; D/A 1x10b | ||||||||
| MC908EY16ACFJE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-s908ey16ae0cfjer-datasheets-0359.pdf | 32-LQFP | EAR99 | 8542.31.00.01 | 260 | MC908EY16 | 40 | Internal | 24 | POR, PWM | 512 x 8 | 8MHz | MICROCONTROLLER | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | LINbus, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||
| MPC564CVR66 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC5xx | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mpc562czp40-datasheets-9791.pdf | 388-BBGA | MPC564 | External | 56 | POR, PWM, WDT | 32K x 8 | 66MHz | PowerPC | 2.5V~2.7V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, SCI, SPI, UART/USART | A/D 32x10b | ||||||||||||||||||||||||||||||||||||||||
| MCR908JL3EMPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Through Hole | -40°C~125°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908jl3ecdwe-datasheets-2915.pdf | 28-DIP (0.600, 15.24mm) | MCR908JL3 | 28-PDIP | External | 23 | LED, LVD, POR, PWM | 128 x 8 | 8MHz | HC08 | 4.5V~5.5V | FLASH | 8-Bit | 4KB 4K x 8 | A/D 12x8b | ||||||||||||||||||||||||||||||||||||||||
| XC68HC58EIAR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 1998 | 28-LCC (J-Lead) | XC68HC58 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S12XDT512CAAR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 2.45mm | ROHS3 Compliant | 2004 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12xd256caa-datasheets-3082.pdf | 80-QFP | 14mm | 14mm | 80 | 3A991.A.2 | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | e3 | Tin (Sn) | YES | QUAD | GULL WING | 260 | 2.5V | 0.65mm | 9S12XDT512 | 2.75V | 2.35V | 40 | Not Qualified | S-PQFP-G80 | External | 59 | LVD, POR, PWM, WDT | 20K x 8 | 80MHz | MICROCONTROLLER | 16 | YES | YES | YES | NO | 80MHz | 2.35V~5.5V | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | A/D 24x10b | 4K x 8 | ||||||||||||
| MCP11A1CFNE3R | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc11a1mfner-datasheets-4086.pdf | 52-LCC (J-Lead) | MCP11A1 | 52-PLCC (19.1x19.1) | External | 38 | POR, WDT | 256 x 8 | 3MHz | HC11 | 4.5V~5.5V | ROMless | 8-Bit | SCI, SPI | A/D 8x8b | 512 x 8 | |||||||||||||||||||||||||||||||||||||||
| MC16Z3BCAG16 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC16 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 1996 | 144-LQFP | MC16Z3 | External | 16 | POR, PWM, WDT | 4K x 8 | 16MHz | CPU16 | 2.7V~5.5V | Mask ROM | 16-Bit | 8KB 8K x 8 | EBI/EMI, SCI, SPI | A/D 8x10b | |||||||||||||||||||||||||||||||||||||||||
| MC908QC8CDXER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908qc8cdxer-datasheets-1589.pdf | 16-SOIC (0.295, 7.50mm Width) | MC908QC8 | Internal | 12 | LVD, POR, PWM | 384 x 8 | 8MHz | 3V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | SCI, SPI | A/D 10x10b | ||||||||||||||||||||||||||||||||||||||||||
| XC705B32CBE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC05 | Through Hole | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc705b16ncfner-datasheets-3962.pdf | 56-SDIP (0.600, 15.24mm) | XC705B32 | Internal | 32 | POR, WDT | 528 x 8 | 2.1MHz | 4.5V~5.5V | OTP | 8-Bit | 32KB 32K x 8 | SCI | A/D 8x8b; D/A 2x8b | 256 x 8 | |||||||||||||||||||||||||||||||||||||||||
| MC9S12E64CFUER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2005 | /files/nxpusainc-mc9s12e64cfue-datasheets-1177.pdf | 80-QFP | MC9S12E64 | 80-QFP (14x14) | Internal | 60 | POR, PWM, WDT | 4K x 8 | 25MHz | HCS12 | 2.35V~2.75V | FLASH | 16-Bit | 64KB 64K x 8 | EBI/EMI, I2C, SCI, SPI | A/D 16x10b; D/A 2x8b | |||||||||||||||||||||||||||||||||||||||
| P89LPC9381FA,112 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC900 | Surface Mount | -40°C~85°C TA | Tube | 1 (Unlimited) | CMOS | 4.57mm | ROHS3 Compliant | 2003 | https://pdf.utmel.com/r/datasheets/nxpusainc-p89lpc9381fdh512-datasheets-1524.pdf | 28-LCC (J-Lead) | 11.505mm | 11.505mm | 28 | ALSO OPERATES AT 2.4V MINIMUM SUPPLY AT 12 MHZ | unknown | 8542.31.00.01 | e3 | TIN | YES | QUAD | J BEND | 245 | 3.3V | 1.27mm | P89LPC9381 | 28 | 3.6V | 3V | 30 | Not Qualified | S-PQCC-J28 | Internal | 26 | Brown-out Detect/Reset, LED, POR, PWM, WDT | 256 x 8 | 18MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 18MHz | 8051 | 2.4V~3.6V | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SPI, UART/USART | A/D 8x10b | |||||||||||
| MC705C8ACPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC05 | Through Hole | -40°C~85°C TA | Tube | Not Applicable | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc705c8acfne-datasheets-1476.pdf | 40-DIP (0.600, 15.24mm) | MC705C8 | 40-PDIP | Internal | 24 | POR, WDT | 304 x 8 | 2.1MHz | HC05 | 3V~5.5V | OTP | 8-Bit | 8KB 8K x 8 | SCI, SPI | ||||||||||||||||||||||||||||||||||||||||
| MC908LK24CPKER | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908lj24cfue-datasheets-5467.pdf | 80-LQFP | MC908LK24 | Internal | 40 | LCD, LVD, POR, PWM | 768 x 8 | 8MHz | 3V~5.5V | FLASH | 8-Bit | 24KB 24K x 8 | I2C, IRSCI, SPI | A/D 6x10b | ||||||||||||||||||||||||||||||||||||||||||
| MC908LK24CPKE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc908lj24cfue-datasheets-5467.pdf | 80-LQFP | MC908LK24 | Internal | 40 | LCD, LVD, POR, PWM | 768 x 8 | 8MHz | 3V~5.5V | FLASH | 8-Bit | 24KB 24K x 8 | I2C, IRSCI, SPI | A/D 6x10b | ||||||||||||||||||||||||||||||||||||||||||
| MPC564MVR56R2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC5xx | Surface Mount | -40°C~125°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2005 | https://pdf.utmel.com/r/datasheets/nxpusainc-mpc562czp40-datasheets-9791.pdf | 388-BBGA | MPC564 | External | 56 | POR, PWM, WDT | 32K x 8 | 56MHz | PowerPC | 2.5V~2.7V | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, SCI, SPI, UART/USART | A/D 32x10b | ||||||||||||||||||||||||||||||||||||||||
| MC711P2CFNE4 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc711p2cfne4-datasheets-1513.pdf | 84-LCC (J-Lead) | MC711P2 | Internal | 50 | POR, PWM, WDT | 1K x 8 | 4MHz | 4.5V~5.5V | OTP | 8-Bit | 32KB 32K x 8 | MI Bus, SCI, SPI | A/D 8x8b | 640 x 8 | |||||||||||||||||||||||||||||||||||||||||
| XC68HC58EIA | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Tube | 3 (168 Hours) | ROHS3 Compliant | 1999 | 28-LCC (J-Lead) | XC68HC58 |
