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ContactDS3172N+
Telecom device2 Circuits
- Manufacturer: Rochester Electronics
- NO: 699-DS3172N+
- Package: 349-BBGA, CSBGA Exposed Pad
- Datasheet:
- Stock: 2675
- Description: Telecom device2 Circuits(Kg)
- Delivery:
- Payment:
In Stock
Please send RFQ , we will respond immediately.
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Shipping starts at $40, but some countries will exceed $40. For
example (South Africa, Brazil, India, Pakistan, Israel, etc.)
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Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 349-BBGA, CSBGA Exposed Pad |
| Supplier Device Package | 400-PBGA (27x27) |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.135V~3.465V |
| Function | Single-Chip Transceiver |
| Interface | DS3, E3 |
| Number of Circuits | 2 |
| Current - Supply | 328mA |
| RoHS Status | ROHS3 Compliant |
DS3172N+ Overview
Space is saved on the board by using the 349-BBGA, CSBGA Exposed Pad package.For packing, Tray is used.A Surface Mount mounting type is used.Telecom circuit is made up of 2 circuits.3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Telecom switching is possible to achieve reliable performance when the operating temperature is set at -40°C~85°C.The supply current is 328mA.
DS3172N+ Features
Available in the 349-BBGA, CSBGA Exposed Pad package
DS3172N+ Applications
There are a lot of Rochester Electronics, LLC DS3172N+ Telecom applications.
- E1 Rates PCM Line Interface
- Digital Cross Connect Systems
- Router
- Digital access cross connects
- E1 Network Equipment
- Interfaces to SONET STS-1 Networks
- Cable PC
- PCM channel bank
- Wireless base stations
- Digital Cross-connect Systems (DCS)
