Products
Manufacturer
RFQ
Nwes
ContactMemory(55331)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mount | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Number of Terminations | Factory Lead Time | Number of Pins | Interface | Density | Pbfree Code | Contact Plating | Radiation Hardening | Reach Compliance Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Voltage | Surface Mount | Voltage - Supply | Terminal Position | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Memory Size | Memory Type | Access Time | Programming Voltage | Clock Frequency | Memory Format | Memory Interface | Organization | Memory Width | Write Cycle Time - Word, Page | Memory Density | Parallel/Serial | Alternate Memory Width | Standby Current-Max | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Access Time (Max) | Sync/Async | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Ready/Busy | Boot Block | Common Flash Interface |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EDFA164A2PH-GD-F-D | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -30°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR3 | ROHS3 Compliant | FBGA | 1.14V~1.95V | 16Gb 256M x 64 | Volatile | 800MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M29F400FB55M32 | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~125°C TA | Bulk | 3 (168 Hours) | FLASH - NOR | 3mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microntechnologyinc-m29f400fb5am6t2-datasheets-4493.pdf | 44-SOIC (0.496, 12.60mm Width) | 28.5mm | 12.6mm | 5V | 44 | 44 | 4 Mb | no | No | 1 | 4.5V | YES | 4.5V~5.5V | DUAL | 235 | 5V | 1.27mm | 30 | 5V | 0.03mA | 4Mb 512K x 8 256K x 16 | Non-Volatile | FLASH | Parallel | 256KX16 | 16 | 55ns | 8 | 0.00012A | 55 ns | YES | YES | YES | 1217 | 16K8K32K64K | YES | BOTTOM | YES | ||||||||||||||||||||||||||||
| EDF8164A3PM-GD-F-D | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -30°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR3 | ROHS3 Compliant | FBGA | 1.14V~1.95V | 8Gb 128M x 64 | Volatile | 800MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EDFA112A2PD-JD-F-D | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -30°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR3 | ROHS3 Compliant | 1.14V~1.95V | 16Gb 128M x 128 | Volatile | 933MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EDFP112A3PF-JD-F-D | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -30°C~85°C TA | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR3 | ROHS3 Compliant | FBGA | 1.14V~1.95V | 24Gb 192M x 128 | Volatile | 933MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT29E3T08EQHBBG2-3ES:B | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 272-LFBGA | 2.5V~3.6V | 3Tb 384G x 8 | Non-Volatile | 333MHz | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EDFP112A3PB-JDTJ-F-D | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -30°C~105°C TC | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR3 | ROHS3 Compliant | FBGA | 1.14V~1.95V | 24Gb 192M x 128 | Volatile | 933MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT43A4G40200NFA-S15 ES:A | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | ROHS3 Compliant | 12 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MTFC16GAKAECN-5M AIT | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | e•MMC™ | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 153-VFBGA | 8 Weeks | 1.7V~1.9V | 128Gb 16G x 8 | Non-Volatile | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| N28H00CB03JDK11E | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EDFP112A3PF-GD-F-D | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -30°C~85°C TA | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR3 | ROHS3 Compliant | FBGA | 1.14V~1.95V | 24Gb 192M x 128 | Volatile | 800MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EDFA112A2PF-JD-F-D | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -30°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR3 | ROHS3 Compliant | FBGA | 9 Weeks | 1.14V~1.95V | 16Gb 128M x 128 | Volatile | 933MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EDFA112A2PF-GD-F-D | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -30°C~85°C TC | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR3 | ROHS3 Compliant | FBGA | 1.14V~1.95V | 16Gb 128M x 128 | Volatile | 800MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BK58F0095HVX010A | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EDFP164A3PB-GD-F-D | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -30°C~85°C TA | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR3 | ROHS3 Compliant | FBGA | 1.14V~1.95V | 216-FBGA (15x15) | 24Gb 384M x 64 | Volatile | 800MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EDFP112A3PB-GDTJ-F-D | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -30°C~105°C TC | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR3 | ROHS3 Compliant | 1.14V~1.95V | 24Gb 192M x 128 | Volatile | 800MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M29DW256G70NF3E | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Bulk | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microntechnologyinc-m29dw256g70nf3e-datasheets-8563.pdf | 56-TFSOP (0.724, 18.40mm Width) | 56 | 2.7V | 2.7V~3.6V | 56-TSOP | 256Mb 16M x 16 | Non-Volatile | 70ns | FLASH | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| N25Q064A13E14D0E | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microntechnologyinc-n25q064a13e12d0e-datasheets-8549.pdf | 24-TBGA | 24 | YES | 2.7V~3.6V | BOTTOM | 1mm | 3/3.3V | 0.02mA | Not Qualified | R-PBGA-B24 | 64Mb 16M x 4 | Non-Volatile | 108MHz | FLASH | SPI | 8MX8 | 8 | 8ms, 5ms | 67108864 bit | SERIAL | 0.0001A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||
| MT29F384G08EBHBBB0KB3WC1-R | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C TA | Tape & Reel (TR) | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 16 Weeks | 2.5V~3.6V | 384Gb 48G x 8 | Non-Volatile | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MT28HL16GPBB3EBK-0GCT | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Bulk | 3 (168 Hours) | ROHS3 Compliant | 5 Weeks | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| EDFP112A3PF-GDTJ-F-D | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | -30°C~105°C TC | Tray | 3 (168 Hours) | SDRAM - Mobile LPDDR3 | ROHS3 Compliant | FBGA | 1.14V~1.95V | 24Gb 192M x 128 | Volatile | 800MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AK93C55AF | AKM Semiconductor Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Bulk | 1 (Unlimited) | EEPROM | https://pdf.utmel.com/r/datasheets/akmsemiconductorinc-ak93c65av-datasheets-8509.pdf | 1.8V~5.5V | 8-SOP | 2Kb 128 x 16 | Non-Volatile | EEPROM | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M29F400FT55M32 | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Automotive, AEC-Q100 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | FLASH - NOR | 3mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microntechnologyinc-m29f400fb5am6t2-datasheets-4493.pdf | 44-SOIC (0.496, 12.60mm Width) | 28.5mm | 12.6mm | 5V | 44 | 44 | 4 Mb | no | No | 1 | 20mA | 4.5V | YES | 4.5V~5.5V | DUAL | 235 | 5V | 1.27mm | 30 | 5V | 4Mb 512K x 8 256K x 16 | Non-Volatile | FLASH | Parallel | 256KX16 | 16 | 55ns | 8 | 0.00012A | 55 ns | Asynchronous | YES | YES | YES | 1217 | 16K8K32K64K | YES | TOP | YES | |||||||||||||||||||||||||||
| MT46V32M16TG-5B IT:JTR | Alliance Memory, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | SDRAM - DDR | Non-RoHS Compliant | 2011 | https://pdf.utmel.com/r/datasheets/alliancememoryinc-mt46v64m8cv5bitj-datasheets-6396.pdf | 66-TSSOP (0.400, 10.16mm Width) | 1 Weeks | 2.5V~2.7V | 512Mb 32M x 16 | Volatile | 700ps | 200MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| M29W512GH70N3E | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~125°C TA | Bulk | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1.2mm | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/microntechnologyinc-m29w512gh7an6e-datasheets-8553.pdf | 56-TFSOP (0.724, 18.40mm Width) | 18.4mm | 14mm | 56 | 4 Weeks | unknown | 1 | YES | 2.7V~3.6V | DUAL | 3V | 0.5mm | 3.6V | 2.7V | R-PDSO-G56 | 512Mb 64M x 8 32M x 16 | Non-Volatile | 2.7V | FLASH | Parallel | 32MX16 | 16 | 70ns | 536870912 bit | 8 | 80 ns | |||||||||||||||||||||||||||||||||||||||
| N25Q064A13E12D0E | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | FLASH - NOR | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/microntechnologyinc-n25q064a13e12d0e-datasheets-8549.pdf | 24-TBGA | 24 | 111 Weeks | YES | 2.7V~3.6V | BOTTOM | 1mm | 3/3.3V | 0.02mA | Not Qualified | S-PBGA-B24 | 64Mb 16M x 4 | Non-Volatile | 108MHz | FLASH | SPI | 8MX8 | 8 | 8ms, 5ms | 67108864 bit | SERIAL | 0.0001A | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | ||||||||||||||||||||||||||||||||||||||||||
| MT29F2T08CUCBBK9-37ES:B | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 0°C~70°C TA | Bulk | 3 (168 Hours) | FLASH - NAND | ROHS3 Compliant | 12 Weeks | 2.7V~3.6V | 2Tb 256G x 8 | Non-Volatile | 267MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AK93C65AF | AKM Semiconductor Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C TA | Bulk | 1 (Unlimited) | EEPROM | https://pdf.utmel.com/r/datasheets/akmsemiconductorinc-ak93c65av-datasheets-8509.pdf | 1.8V~5.5V | 8-SOP | 4Kb 256 x 16 | Non-Volatile | EEPROM | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| N25Q00AA11G1240E | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | Surface Mount | -40°C~85°C TA | Bulk | 3 (168 Hours) | FLASH - NOR | SYNCHRONOUS | 1.3mm | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/microntechnologyinc-n25q00aa11g1240e-datasheets-8556.pdf | 24-LBGA | 8mm | 6mm | 1.8V | 24 | 24 | SPI, Serial | 1 Gb | yes | Copper, Silver, Tin | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.7V | 1.7V~2V | BOTTOM | 260 | 1.8V | 1mm | 30 | 1Gb 256M x 4 | Non-Volatile | 9 ns | 108MHz | FLASH | SPI | 1GX1 | 1 | 8ms, 5ms | |||||||||||||||||||||||||||||||||||
| MT53B384M16D1Z0AQWC1 | Micron Technology Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 0°C~85°C TC | Bulk | 3 (168 Hours) | SDRAM - Mobile LPDDR4 | ROHS3 Compliant | 1.1V | 6Gb 384M x 16 | Volatile | DRAM |
