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ContactMicrocontrollers(83924)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Series | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Technology | Frequency | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Number of Terminations | Factory Lead Time | REACH SVHC | Max Supply Voltage | Min Supply Voltage | Number of Pins | Interface | ECCN Code | Additional Feature | Radiation Hardening | Max Frequency | Reach Compliance Code | HTS Code | JESD-609 Code | Terminal Finish | Surface Mount | Max Power Dissipation | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Subcategory | Power Supplies | Supply Current-Max | Qualification Status | JESD-30 Code | Supplier Device Package | Screening Level | Memory Size | Number of ADC Channels | Oscillator Type | Number of I/O | Memory Type | Peripherals | RAM Size | Data Bus Width | Speed | uPs/uCs/Peripheral ICs Type | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | Watchdog Timer | Number of Timers/Counters | Number of Programmable I/O | ROM (words) | Boundary Scan | Low Power Mode | Format | Integrated Cache | Number of PWM Channels | Clock Frequency | Address Bus Width | External Data Bus Width | Core Processor | Voltage - Supply (Vcc/Vdd) | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Converter | EEPROM Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MC9S08DV96MLH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08dz128clh-datasheets-5185.pdf | 64-LQFP | MC9S08DV96 | External | 53 | LVD, POR, PWM, WDT | 4K x 8 | 40MHz | 2.7V~5.5V | FLASH | 8-Bit | 96KB 96K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 24x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08DN16AMLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-s9s08dn48f2mlf-datasheets-0465.pdf | 32-LQFP | MC9S08DN16 | 32-LQFP (7x7) | External | 25 | LVD, POR, PWM, WDT | 1K x 8 | 40MHz | S08 | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | A/D 10x12b | 512 x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PC9S08QE64CLH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08qe128clh-datasheets-9370.pdf | 64-LQFP | PC9S08QE64 | Internal | 54 | LVD, PWM, WDT | 4K x 8 | 50MHz | 1.8V~3.6V | FLASH | 8-Bit | 64KB 64K x 8 | I2C, LINbus, SCI, SPI | A/D 22x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PC56F8006VLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | 56F8xxx | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc56f8006vwl-datasheets-2668.pdf | 48-LQFP | PC56F8006 | 48-LQFP (7x7) | Internal | 40 | LVD, POR, PWM, WDT | 1K x 16 | 32MHz | 56800 | 1.8V~3.6V | FLASH | 16-Bit | 16KB 8K x 16 | I2C, LINbus, SCI, SPI | A/D 24x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF5207CAG166 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF520x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | CMOS | 1.6mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf5208cvm166-datasheets-8685.pdf | 144-LQFP | 20mm | 20mm | 144 | 3A991.A.2 | 8542.31.00.01 | YES | QUAD | GULL WING | NOT SPECIFIED | 1.5V | 0.5mm | MCF5207 | 1.6V | 1.4V | NOT SPECIFIED | S-PQFP-G144 | External | 30 | DMA, WDT | 16K x 8 | 166.67MHz | MICROPROCESSOR, RISC | 32 | YES | YES | FIXED POINT | YES | 40MHz | 24 | 32 | Coldfire V2 | 1.4V~3.6V | ROMless | 32-Bit | EBI/EMI, I2C, SPI, UART/USART | |||||||||||||||||||||||||||||||||||||||||||
| MC908GR8ACDWE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC08 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mchc908gr8acfae-datasheets-0666.pdf | 28-SOIC (0.295, 7.50mm Width) | MC908GR8 | Internal | 17 | LVD, POR, PWM | 384 x 8 | 8MHz | 2.7V~5.5V | FLASH | 8-Bit | 7.5KB 7.5K x 8 | SCI, SPI | A/D 6x8b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PC9RS08LA8CLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RS08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | /files/nxpusainc-mc9rs08la8clf-datasheets-2642.pdf | 48-LQFP | PC9RS08LA8 | 48-LQFP (7x7) | Internal | 33 | LCD, LVD, POR, PWM, WDT | 256 x 8 | 20MHz | RS08 | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | SCI, SPI | A/D 6x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08SV16CBM | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08sv8cbm-datasheets-1417.pdf | 32-SDIP (0.400, 10.16mm) | MC9S08SV16 | 32-SDIP | Internal | 30 | LVD, POR, PWM, WDT | 1K x 8 | 40MHz | S08 | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | A/D 12x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF53011CQT240 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF5301x | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf53011cqt240-datasheets-1489.pdf | 208-LQFP | MCF53011 | Internal | 61 | DMA, PWM, WDT | 128K x 8 | 240MHz | Coldfire V3 | 1.08V~3.6V | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCP11A1CFNE3 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 1996 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc11a1mfner-datasheets-4086.pdf | 52-LCC (J-Lead) | MCP11A1 | 52-PLCC (19.1x19.1) | External | 38 | POR, WDT | 256 x 8 | 3MHz | HC11 | 4.5V~5.5V | ROMless | 8-Bit | SCI, SPI | A/D 8x8b | 512 x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC5123VY400B | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC5123 | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-spc5123yvy400b-datasheets-7153.pdf | 516-BBGA | MPC5123 | 516-FPBGA (27x27) | External | 147 | DMA, WDT | 128K x 8 | 400MHz | e300 | 1.08V~3.6V | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF51JM64EVQH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51JM | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf51jm128vlh-datasheets-9927.pdf | 64-QFP | MCF51JM64 | 64-QFP (14x14) | External | 51 | LVD, PWM, WDT | 16K x 8 | 50MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, SCI, SPI, USB OTG | A/D 12x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PC9RS08LA8CFT | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RS08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9rs08la8clf-datasheets-2642.pdf | 48-VFQFN Exposed Pad | PC9RS08LA8 | Internal | 33 | LCD, LVD, POR, PWM, WDT | 256 x 8 | 20MHz | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | SCI, SPI | A/D 6x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCR705JP7CDWE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC05 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2013 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc705jp7cdw-datasheets-9797.pdf | 28-SOIC (0.295, 7.50mm Width) | MCR705 | Internal | 22 | POR, Temp Sensor, WDT | 224 x 8 | 2.1MHz | 2.7V~5.5V | OTP | 8-Bit | 6KB 6K x 8 | SIO | A/D 4x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9RS08KA8CPJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | RS08 | Through Hole | -40°C~85°C TA | Tube | Not Applicable | CMOS | 5.08mm | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9rs08ka4cpj-datasheets-7150.pdf | 20-DIP (0.300, 7.62mm) | 24.69mm | 7.62mm | 20 | 10 Weeks | EAR99 | 8542.31.00.01 | e3 | Matte Tin (Sn) | NO | DUAL | NOT SPECIFIED | 3V | 2.54mm | MC9RS08KA8 | 5.5V | 1.8V | NOT SPECIFIED | Microcontrollers | 2/5V | Not Qualified | R-PDIP-T20 | Internal | 18 | LVD, POR, PWM, WDT | 254 x 8 | 20MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 8192 | 5MHz | 1.8V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C | A/D 12x10b | |||||||||||||||||||||||||||||||||||||
| MC9S08SE8VRL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Through Hole | -40°C~105°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08se8cwl-datasheets-3411.pdf | 28-DIP (0.600, 15.24mm) | MC9S08SE8 | Internal | 24 | LVD, POR, PWM | 512 x 8 | 20MHz | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | LINbus, SCI | A/D 10x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S12XHZ256VAGR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HCS12X | Surface Mount | -40°C~105°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s12xhz256vagr-datasheets-1462.pdf | 144-LQFP | MC9S12XHZ256 | External | 117 | LCD, Motor control PWM, POR, PWM, WDT | 16K x 8 | 80MHz | 2.35V~5.5V | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, LINbus, SCI, SPI | A/D 16x8/10b | 4K x 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF51JM32EVLH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51JM | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf51jm128vlh-datasheets-9927.pdf | 64-LQFP | MCF51JM32 | External | 51 | LVD, PWM, WDT | 16K x 8 | 50MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 32KB 32K x 8 | CANbus, I2C, SCI, SPI, USB OTG | A/D 12x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08SH16MWL | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tube | 3 (168 Hours) | CMOS | 2.65mm | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08sh16ctg-datasheets-5382.pdf | 28-SOIC (0.295, 7.50mm Width) | 17.925mm | 7.5mm | 28 | EAR99 | 8542.31.00.01 | YES | DUAL | GULL WING | 3V | 1.27mm | MC9S08SH16 | 5.5V | 2.7V | R-PDSO-G28 | AEC-Q100 | Internal | 23 | LVD, POR, PWM, WDT | 1K x 8 | 40MHz | MICROCONTROLLER | 8 | YES | NO | YES | NO | 40MHz | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | A/D 16x10b | |||||||||||||||||||||||||||||||||||||||||||||
| MCHSC705C8ACPE | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC05 | Through Hole | -40°C~85°C TA | Tube | Not Applicable | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc68hc705c8acfne-datasheets-1476.pdf | 40-DIP (0.600, 15.24mm) | MCHC705 | 40-PDIP | Internal | 24 | POR, WDT | 304 x 8 | 4MHz | HC05 | 3V~5.5V | OTP | 8-Bit | 8KB 8K x 8 | SCI, SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| P89LPC9331FDH,512 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC900 | Surface Mount | -40°C~85°C TA | Tube | 2 (1 Year) | CMOS | ROHS3 Compliant | 2010 | https://pdf.utmel.com/r/datasheets/nxpusainc-p89lpc9361fdh518-datasheets-1621.pdf | 28-TSSOP (0.173, 4.40mm Width) | 28 | 8542.31.00.01 | e3 | MATTE TIN | YES | DUAL | GULL WING | NOT SPECIFIED | 0.635mm | P89LPC93*1 | 28 | NOT SPECIFIED | Microcontrollers | 2.5/3.3V | 23mA | Not Qualified | R-PDSO-G28 | Internal | 26 | Brown-out Detect/Reset, POR, PWM, WDT | 256 x 8 | 18MHz | 8 | 4096 | 8051 | 2.4V~3.6V | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SPI, UART/USART | A/D 8x8b; D/A 2x8b | |||||||||||||||||||||||||||||||||||||||||||||||
| MCF51JM32EVQH | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MCF51JM | Surface Mount | -40°C~105°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2007 | https://pdf.utmel.com/r/datasheets/nxpusainc-mcf51jm128vlh-datasheets-9927.pdf | 64-QFP | MCF51JM32 | 64-QFP (14x14) | External | 51 | LVD, PWM, WDT | 16K x 8 | 50MHz | Coldfire V1 | 2.7V~5.5V | FLASH | 32-Bit | 32KB 32K x 8 | CANbus, I2C, SCI, SPI, USB OTG | A/D 12x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPC5121VY400B | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | MPC5121e | Surface Mount | 0°C~70°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-spc5123yvy400b-datasheets-7153.pdf | 516-BBGA | MPC5121 | 516-FPBGA (27x27) | External | 147 | DMA, WDT | 128K x 8 | 400MHz | e300 | 1.08V~3.6V | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LPC2102FHN48,551 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | LPC2100 | Surface Mount | -40°C~85°C TA | Tray | 1 (Unlimited) | CMOS | 1mm | ROHS3 Compliant | 2009 | https://pdf.utmel.com/r/datasheets/nxpusainc-lpc2103fbd48118-datasheets-0996.pdf | 48-VFQFN Exposed Pad | 6mm | 6mm | 48 | ALSO REQUIRES 3.3 V SUPPLY | unknown | 8542.31.00.01 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | YES | QUAD | NO LEAD | 260 | 1.8V | 0.4mm | LPC2102 | 48 | 1.95V | 1.65V | 40 | Microcontrollers | 1.83.3V | Not Qualified | S-PQCC-N48 | Internal | 32 | POR, PWM, WDT | 4K x 8 | 70MHz | MICROCONTROLLER, RISC | 32 | YES | NO | YES | NO | 16384 | 25MHz | ARM7® | 1.65V~3.6V | FLASH | 16/32-Bit | 16KB 16K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | A/D 8x10b | ||||||||||||||||||||||||||||||||||
| MC9S08SH16CWLR | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tape & Reel (TR) | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08sh16ctg-datasheets-5382.pdf | 28-SOIC (0.295, 7.50mm Width) | MC9S08SH16 | Internal | 23 | LVD, POR, PWM, WDT | 1K x 8 | 40MHz | MICROCONTROLLER | 2.7V~5.5V | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | A/D 16x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MB96F326RSBPMC-GSE2 | Fujitsu Electronics America, Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | F2MC-16FX MB96320 | Surface Mount | -40°C~125°C TA | Tray | 1 (Unlimited) | 125°C | -40°C | 56MHz | RoHS Compliant | 2008 | https://pdf.utmel.com/r/datasheets/fujitsuelectronicsamericainc-mb96f326rsbpmcgse2-datasheets-1424.pdf | 80-LQFP | 8 Weeks | Unknown | 5.5V | 3V | 80 | CAN, EBI/EMI, I2C, LIN, SCI, UART, USART | No | 56MHz | 750mW | 80-LQFP (12x12) | 288kB | 18 | Internal | 66 | FLASH | DMA, LVD, LVR, POR, PWM, WDT | 12K x 8 | 16b | 56MHz | Yes | 3 | 66 | 20 | F2MC-16FX | 3V~5.5V | FLASH | 16-Bit | 288KB 288K x 8 | CANbus, EBI/EMI, I2C, LINbus, SCI, UART/USART | A/D 18x10b | ||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08SH32VTJ | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~105°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | 2014 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08sh16ctg-datasheets-5382.pdf | 20-TSSOP (0.173, 4.40mm Width) | MC9S08SH32 | Internal | 17 | LVD, POR, PWM, WDT | 1K x 8 | 40MHz | 2.7V~5.5V | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | A/D 12x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC68HC11D0CFNE2 | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | HC11 | Surface Mount | -40°C~85°C TA | Tube | 3 (168 Hours) | ROHS3 Compliant | https://pdf.utmel.com/r/datasheets/nxpusainc-mc711d3cfne2r-datasheets-3880.pdf | 44-LCC (J-Lead) | MC68HC11 | 44-PLCC (16.59x16.59) | Internal | 26 | POR, WDT | 192 x 8 | 2MHz | HC11 | 4.5V~5.5V | ROMless | 8-Bit | SCI, SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08DV128MLF | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~125°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2002 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08dz128clh-datasheets-5185.pdf | 48-LQFP | MC9S08DV128 | External | 39 | LVD, POR, PWM, WDT | 6K x 8 | 40MHz | 2.7V~5.5V | FLASH | 8-Bit | 128KB 128K x 8 | CANbus, I2C, LINbus, SCI, SPI | A/D 16x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC9S08SV8CLC | NXP USA Inc. |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | S08 | Surface Mount | -40°C~85°C TA | Tray | 3 (168 Hours) | ROHS3 Compliant | 2006 | https://pdf.utmel.com/r/datasheets/nxpusainc-mc9s08sv8cbm-datasheets-1417.pdf | 32-LQFP | MC9S08SV8 | 32-LQFP (7x7) | Internal | 30 | LVD, POR, PWM, WDT | 768 x 8 | 40MHz | S08 | 2.7V~5.5V | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | A/D 12x10b |
