DS2176

24 TerminationsTelecom device1 Circuits

Manufacturer: Rochester Electronics
NO: 699-DS2176
Package: 24-DIP (0.300, 7.62mm)
Datasheet:
Stock: 7947
Description: 24 TerminationsTelecom device1 Circuits(Kg)

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SPECIFICATIONS

Parameters
Mounting Type	Through Hole
Package / Case	24-DIP (0.300, 7.62mm)
Surface Mount	NO
Operating Temperature	0°C~70°C
Packaging	Tube
JESD-609 Code	e0
Pbfree Code	no
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	24
Terminal Finish	TIN LEAD
Technology	CMOS
Terminal Position	DUAL
Peak Reflow Temperature (Cel)	240
Supply Voltage	5V
Terminal Pitch	2.54mm
Reach Compliance Code	unknown
Time@Peak Reflow Temperature-Max (s)	20
JESD-30 Code	R-PDIP-T24
Function	Receive Buffer
Qualification Status	COMMERCIAL
Interface	TDM
Number of Circuits	1
Current - Supply	5mA
Telecom IC Type	ELASTIC BUFFER
Height Seated (Max)	4.572mm
Length	30.545mm
Width	7.62mm
RoHS Status	Non-RoHS Compliant

DS2176 Overview

To save board space, the 24-DIP (0.300, 7.62mm) package is used.Telecommunications equipment is packed using the Tube method.A Through Hole mounting type is used.A 1-circuit composes this telecom IC .At 0°C~70°C, reliable performance can be achieved.24 terminations can be found in the configuration.With 5V as the supply voltage, it operates.ELASTIC BUFFER is the type of IC it uses for telecom.5mA is the supply current.