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ContactQS723621-30TF
144 TerminationsFIFO memory IC72K 2K x 3630ns
- Manufacturer: Rochester Electronics
- NO: 699-QS723621-30TF
- Package: 144-QFP
- Datasheet:
- Stock: 4486
- Description: 144 TerminationsFIFO memory IC72K 2K x 3630ns (Kg)
- Delivery:
- Payment:
In Stock
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| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 144-QFP |
| Surface Mount | YES |
| Operating Temperature | 0°C~70°C |
| Packaging | Bulk |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Number of Terminations | 144 |
| Terminal Finish | TIN LEAD |
| Additional Feature | RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX |
| Technology | CMOS |
| Terminal Position | QUAD |
| Terminal Form | GULL WING |
| Supply Voltage | 5V |
| JESD-30 Code | S-PQFP-G144 |
| Function | Synchronous |
| Qualification Status | COMMERCIAL |
| Supply Voltage-Max (Vsup) | 5.5V |
| Supply Voltage-Min (Vsup) | 4.5V |
| Memory Size | 72K 2K x 36 |
| Access Time | 30ns |
| Organization | 2KX36 |
| Memory Width | 36 |
| Memory Density | 73728 bit |
| Parallel/Serial | PARALLEL |
| FWFT Support | No |
| Programmable Flags Support | Yes |
| Output Enable | YES |
| Cycle Time | 30 ns |
| RoHS Status | ROHS3 Compliant |
QS723621-30TF Overview
You can find FIFO memory chip in package 144-QFP .Bulk case is used for packaging.Data and applications can be stored in the FIFO chip's 72K 2K x 36 memory.It is recommended that the temperature be regulated to 0°C~70°C to ensure reliable operation.A mounting type of Surface Mount is associated with the FIFO memory.When the supply voltage is 5V there is the possibility of high efficiency.FIFO means contains 144 terminations.Using this gadget, RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX can also be generated.Voltage FIFO memory IC's maximum is set to 5.5V .The supply voltage (Vsup) should remain above 4.5V to ensure normal operation.
QS723621-30TF Features
72K 2K x 36 memory size
QS723621-30TF Applications
There are a lot of Rochester Electronics, LLC QS723621-30TF FIFOs Memory applications.
- Microprogramming
- Battery Charger
- Laser Receiver System
- Computers
- General Data Collection Applications at Low-Temperatures
- Extended product-change notification
- Thermal Management for DDR3 Memory Modules
- IP Camera Buffer
- Switches
- Cardiac Monitoring Device
