XCZU15EG-2FFVC900I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 204 I/O

Manufacturer: Xilinx
NO: 903-XCZU15EG-2FFVC900I
Package: 900-BBGA, FCBGA
Datasheet:
Stock: 7523
Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 204 I/O(Kg)

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SPECIFICATIONS

Parameters
Factory Lead Time	11 Weeks
Package / Case	900-BBGA, FCBGA
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	204
Speed	533MHz, 600MHz, 1.3GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 747K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).

Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.Internally, this SoC design uses the MCU, FPGA technique.Zynq? UltraScale+? MPSoC EG is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.This SoC security combines Zynq?UltraScale+? FPGA, 747K+ Logic Cells, an important feature to keep in mind.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 204 inputs and outputs.