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0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 328 I/O
- Manufacturer: Xilinx
- NO: 903-XCZU9CG-1FFVB1156E
- Package: 1156-BBGA, FCBGA
- Datasheet:
- Stock: 9286
- Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 328 I/O(Kg)
- Delivery:
- Payment:
In Stock
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Currently, our products are shipped through DHL, FedEx, SF, and UPS.
Delivery TimeOnce the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.
| Parameters | |
|---|---|
| Factory Lead Time | 11 Weeks |
| Package / Case | 1156-BBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2013 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 328 |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, this SoC has been developed.The manufacturer assigns this system on a chip with a 1156-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MCU, FPGA architecture for its internal architecture.The system on a chip is part of the series Zynq? UltraScale+? MPSoC CG.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 599K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.328 I/Os in total are included in this SoC part.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU9CG-1FFVB1156E System On Chip (SoC) applications.
- Flow Sensors
- Apple smart watch
- Smart appliances
- Mouse
- Transmitters
- Test and Measurement
- Functional safety for critical applications in the automotive
- AC-input BLDC motor drive
- Networked sensors
- Industrial automation devices
