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ContactConfiguration Proms for FPGAs(667)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Part Status | Mounting Type | Operating Temperature | Packaging | Moisture Sensitivity Level (MSL) | Technology | Operating Mode | Height Seated (Max) | RoHS Status | Published | Datasheet | Package / Case | Length | Width | Operating Supply Voltage | Lead Free | Number of Terminations | Number of Pins | Pbfree Code | ECCN Code | Additional Feature | Radiation Hardening | Reach Compliance Code | Number of Functions | JESD-609 Code | Terminal Finish | Surface Mount | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Base Part Number | Pin Count | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Time@Peak Reflow Temperature-Max (s) | Power Supplies | Supply Current-Max | Qualification Status | Supplier Device Package | Memory Size | Output Characteristics | Clock Frequency | Organization | Memory Width | Memory Density | Parallel/Serial | Standby Current-Max | I/O Type | Memory IC Type | Programmable Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| AT17N512-10SC | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | Non-RoHS Compliant | 1997 | /files/microchiptechnology-at17n25610pi-datasheets-4303.pdf | 20-SOIC (0.295, 7.50mm Width) | 3V~3.6V | AT17N512 | 20-SOIC | 512kb | Serial EEPROM | ||||||||||||||||||||||||||||||||||||||||||
| XC1736ESOG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 1.7272mm | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-SOIC (0.154, 3.90mm Width) | 4.9276mm | 3.937mm | Lead Free | 8 | 8 | yes | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | unknown | 1 | e3 | Matte Tin (Sn) | YES | 4.75V~5.25V | DUAL | GULL WING | 260 | 5V | 1.27mm | XC1736E | 8 | 5.25V | 4.75V | 40 | 5V | 0.01mA | Not Qualified | 36kb | 3-STATE | 10MHz | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||
| XC17S200APDG8I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | 4.5974mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s200apdg8i-datasheets-4355.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 3.3V | 8 | 8 | yes | EAR99 | No | 1 | e3 | Matte Tin (Sn) | NO | 3V~3.6V | DUAL | 250 | 3.3V | 2.54mm | XC17S200A | 8 | 3.6V | 3V | 30 | 0.015mA | 2Mb | 3-STATE | 1 | SERIAL | 0.001A | COMMON | CONFIGURATION MEMORY | OTP | ||||||||||||||
| XC1701LPDG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 4.5974mm | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 8 | 8 | yes | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 1 | e3 | Matte Tin (Sn) | NO | 3V~3.6V | DUAL | 250 | 3.3V | 2.54mm | XC1701L | 8 | 3.6V | 3V | 30 | 3.3V | 0.01mA | Not Qualified | 1Mb | 3-STATE | 15MHz | 1MX1 | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP | |||||||||||
| AT17LV002A-10CU | Microchip Technology |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Surface Mount | -40°C~85°C | Tube | 3 (168 Hours) | ROHS3 Compliant | 1997 | /files/microchiptechnology-at17lv002a10cu-datasheets-4359.pdf | 8-TDFN | 3V~3.6V 4.5V~5.5V | AT17LV002A | 8-LAP (6x6) | 2Mb | Serial EEPROM | ||||||||||||||||||||||||||||||||||||||||||
| XC17S10XLPDG8C | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | 0°C~70°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 4.5974mm | RoHS Compliant | 1999 | /files/xilinxinc-xc17s10xlpdg8c-datasheets-4365.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 8 | 8 | EAR99 | unknown | 1 | e3 | Matte Tin (Sn) | NO | 3V~3.6V | DUAL | 250 | 3.3V | 2.54mm | XC17S10XL | 8 | 3.6V | 3V | 30 | 3.3V | 0.005mA | Not Qualified | 100kb | 3-STATE | 10MHz | 95752X1 | 1 | 95752 bit | 0.00005A | COMMON | MEMORY CIRCUIT | OTP | |||||||||||
| XC1701LPDG8I | Xilinx |
Min: 1 Mult: 1 |
0 | 0x0x0 | download | Through Hole | -40°C~85°C | Tube | 1 (Unlimited) | CMOS | SYNCHRONOUS | 4.5974mm | RoHS Compliant | 2004 | /files/xilinxinc-xc1736esog8c-datasheets-4352.pdf | 8-DIP (0.300, 7.62mm) | 9.3599mm | 7.62mm | 8 | 8 | yes | EAR99 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | unknown | 1 | e3 | Matte Tin (Sn) | NO | 3V~3.6V | DUAL | 250 | 3.3V | 2.54mm | XC1701L | 8 | 3.6V | 3V | 30 | 3.3V | 0.01mA | Not Qualified | 1Mb | 3-STATE | 15MHz | 1MX1 | 1 | SERIAL | 0.00005A | COMMON | CONFIGURATION MEMORY | OTP |
